Intel StrataFlash® Wireless Memory (L18)
4.0
Ballout and Signal Descriptions
4.1
Signal Ballout
This section includes signal ballouts for the following packages:
• VF BGA Package Ballout
• SCSP Package Ballout
4.1.1
VF BGA Package Ballout
The Intel StrataFlash® Wireless Memory (L18) is available in a VF BGA package with 0.75 mm
ball-pitch. Figure 5 shows the ballout for the 64-Mbit and 128-Mbit devices in the 56-ball VF BGA
package with a 7x8 active-ball matrix. Figure 6 shows the device ballout for the 256-Mbit device in
the 63-ball VF BGA package with a 7x9 active-ball matrix. Both package densities are ideal for
space-constrained board applications
Figure 5.
7x8 Active-Ball Matrix for 64-, and 128-Mbit Densities in VF BGA Packages
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
A
A
B
C
D
E
F
A11
A8
A9
VSS
A20
VCC
CLK
VPP
A18
A17
A6
A5
A4
A3
A4
A3
A6
A5
A18
A17
VPP
VCC
CLK
VSS
A20
A8
A9
A11
A12
B
A12
RST#
RST#
C
A13
A10
A14
A21
WAIT
D6
ADV#
A16
D4
WE#
D12
A19
A7
A22
CE#
D0
A2
A1
A2
A1
A7
A22
CE#
D0
A19
WE#
D12
ADV#
A16
A21
WAIT
D6
A10
A14
A13
A15
D
WP#
WP#
A15
E
VCCQ
F
D4
VCCQ
D15
D2
D10
D3
D1
D9
A0
A0
D1
D9
D2
D10
D3
D15
OE#
OE#
VSS
G
D14
D13
D5
D11
D11
D13
D5
D14
VSS
D7
G
D7
VSSQ
VCC
VCCQ
D8
VSSQ
VSSQ
D8
VCCQ
VCC
VSSQ
VFBGA 7x8
Top View - Ball Side Down
VFBGA 7x8
Bottom View - Ball Side Up
Note: On lower-density devices, upper-address balls can be treated as NC. (e.g., for 64-Mbit density, A22 will be NC)
April 2005
16
Intel StrataFlash® Wireless Memory (L18)
Order Number: 251902, Revision: 009
Datasheet
INTEL [ INTEL ]
