28F016B3 参数 Datasheet PDF下载

SMART 3 ADVANCED BOOT BLOCK

E

4

5

16M

6

7

8

V

PP

WP#

8M

A

20

A

7

A

4

RP#

32M

A

19

A

18

A

5

A

2

A

21

A

6

A

3

A

1

NC

D

2

NC

CE#

A

0

NC

D

3

NC

D

0

GND

1

2

3

A

A

14

A

12

A

8

B

A

15

A

10

WE#

C

A

16

A

13

A

9

D

A

17

NC

D

5

E

V

CCQ

A

11

D

6

F

GND

D

7

NC

D

4

V

CC

NC

D

1

OE#

0580_04

NOTE:

1.

Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address

solder balls. Routing is not recommended in this area. A

20

is the upgrade address for the 16-Mbit device. A

21

is the

upgrade address for the 32-Mbit device.

2.

4-Mbit density not available in

µBGA*

CSP.

Figure 3. x8 48-Ball

µBGA*

Chip Size Package (Top View, Ball Down)

8

PRELIMINARY