E
SMART 3 ADVANCED BOOT BLOCK–BYTE-WIDE
CONTENTS
PAGE
1.0 INTRODUCTION .............................................5
1.1 Smart 3 Advanced Boot Block Flash
Memory Enhancements ..............................5
1.2 Product Overview.........................................6
2.0 PRODUCT DESCRIPTION..............................6
2.1 Package Pinouts ..........................................7
2.2 Block Organization .....................................11
2.2.1 Parameter Blocks ................................11
2.2.2 Main Blocks .........................................11
3.0 PRINCIPLES OF OPERATION .....................14
3.1 Bus Operation ............................................14
3.1.1 Read....................................................15
3.1.2 Output Disable.....................................15
3.1.3 Standby ...............................................15
3.1.4 Deep Power-Down/Reset ....................15
3.1.5 Write....................................................15
3.2 Modes of Operation....................................15
3.2.1 Read Array ..........................................16
3.2.2 Read Intelligent Identifier .....................17
3.2.3 Read Status Register ..........................17
3.2.4 Program Mode.....................................18
3.2.5 Erase Mode .........................................19
3.3 Block Locking.............................................26
3.3.1 V
PP
= V
IL
for Complete Protection .......26
3.3.2 WP# = V
IL
for Block Locking................26
3.3.3 WP# = V
IH
for Block Unlocking ............26
3.4 V
PP
Program and Erase Voltages ..............26
PAGE
3.5 Power Consumption ...................................26
3.5.1 Active Power .......................................26
3.5.2 Automatic Power Savings (APS) .........27
3.5.3 Standby Power ....................................27
3.5.4 Deep Power-Down Mode.....................27
3.6 Power-Up/Down Operation.........................27
3.6.1 RP# Connected to System Reset ........27
3.6.2 V
CC
, V
PP
and RP# Transitions .............27
3.7 Power Supply Decoupling ..........................28
3.7.1 V
PP
Trace on Printed Circuit Boards ....28
4.0 ABSOLUTE MAXIMUM RATINGS ................29
5.0 OPERATING CONDITIONS
(V
CCQ
= 2.7V–3.6V).......................................29
5.1 DC Characteristics: V
CCQ
= 2.7V–3.6V.......30
6.0 OPERATING CONDITIONS
(V
CCQ
= 1.8V–2.2V).......................................34
6.1 DC Characteristics: V
CCQ
= 1.8V–2.2V.......34
7.0 AC CHARACTERISTICS...............................39
7.1 Reset Operations .......................................43
APPENDIX A: Ordering Information .................45
APPENDIX B: Write State Machine Current/
Next States ..................................................46
APPENDIX C: Access Time vs.
Capacitive Load...........................................47
APPENDIX D: Architecture Block Diagram ......48
APPENDIX E: Additional Information ...............49
PRELIMINARY
3
INTEL [ INTEL CORPORATION ]
