AIROC™ Bluetooth® system on chip for automotive applications
Table of contents
11.2.2 Recommended component ............................................................................................................................34
11.2.3 Digital LDO........................................................................................................................................................34
11.2.4 Recommended component ............................................................................................................................35
11.2.5 RF LDO ..............................................................................................................................................................35
11.2.6 PALDO...............................................................................................................................................................36
11.2.7 Recommended component ............................................................................................................................37
11.2.8 Digital I/O characteristics ................................................................................................................................37
11.2.9 Current consumption ......................................................................................................................................37
11.3 RF specifications .................................................................................................................................................38
11.4 Timing and AC characteristics............................................................................................................................40
11.4.1 UART timing .....................................................................................................................................................40
11.4.2 SPI timing .........................................................................................................................................................41
11.4.3 BSC interface timing ........................................................................................................................................42
11.4.4 I2S .....................................................................................................................................................................43
12 Package information ...................................................................................................................45
12.1 Package thermal characteristics........................................................................................................................45
13 Packaging diagrams ....................................................................................................................46
13.1 48-Pin WQFN package.........................................................................................................................................46
13.2 Tape reel and packaging specifications ............................................................................................................47
14 Ordering information ..................................................................................................................48
15 Acronyms ...................................................................................................................................49
Revision history ..............................................................................................................................52
Datasheet
5
002-25826 Rev. *G
2022-09-24
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