2N7002
Parameter
Symbol Conditions
min.
Thermal characteristics
Thermal resistance,
junction - minimal footprint
(2)
R
thJA
Values
typ.
max.
Unit
-
-
250
K/W
Electrical characteristics,
at
T
j
=25 °C, unless otherwise specified
Static characteristics
V
(BR)DSS
V
GS
= 0 V,
I
D
=250 µA
Drain-source breakdown voltage
60
-
-
V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
,
I
D
=250 µA
V
DS
=60 V,
V
GS
=0 V,
T
j
=25 °C
V
DS
=60 V,
V
GS
=0 V,
T
j
=150 °C
1.5
2.1
2.5
Drain-source leakage current
I
D (off)
-
-
0.1
µA
-
-
5
Gate-source leakage current
Drain-source on-state resistance
I
GSS
R
DS(on)
V
GS
=20 V,
V
DS
=0 V
V
GS
=4.5 V,
I
D
=0.25 A
V
GS
=10 V,
I
D
=0.5 A
-
-
-
0.2
1
2.0
1.6
0.36
10
4
3
-
nA
Ω
Transconductance
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=0.24 A
S
Perfomed on a 40x40mm
2
FR4 PCB with both sided Cu sense-force traces, each 1mm wide, 70µm thick and 20mm
long.
(2)
Rev. 2.3
page 2
2010-08-26
INFINEON [ INFINEON TECHNOLOGIES AG ]
