ICS508
PECL TO CMOS CONVERTER
PECL TO CMOS TRANSLATOR
Package Outline and Package Dimensions
(8 pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
8
Millimeters
Symbol
Min
Max
Inches
Min
Max
E
INDEX
AREA
H
1 2
D
A
A1
B
C
D
E
e
H
h
L
α
1.35
1.75
0.10
0.25
0.33
0.51
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BASIC
5.80
6.20
0.25
0.50
0.40
1.27
0
°
8
°
h x 45
.0532
.0688
.0040
.0098
.013
.020
.0075
.0098
.1890
.1968
.1497
.1574
0.050 BASIC
.2284
.2440
.010
.020
.016
.050
0
°
8
°
A
A1
C
-C-
e
B
SEATING
PLANE
L
.10 (.004)
C
*Ordering Information
Part / Order Number
508MLF
508MLFT
508MILF
508MILFT
508-DWF
508-DPK
Marking
see page 6
Shipping Packaging
Package
Temperature
0 to +70° C
0 to +70° C
-40 to +85° C
-40 to +85° C
0 to +70° C
0 to +70° C
-
-
Tubes
8 pin SOIC
Tape and Reel
8 pin SOIC
Tubes
8 pin SOIC
Tape and Reel
8 pin SOIC
Die on uncut, probed wafers
Tested die in waffle pack
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no
responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other
circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those
requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without
additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant
any IDT product for use in life support devices or critical medical instruments.
IDT™ / ICS™
PECL TO CMOS CONVERTER
7
ICS508
REV H 051310
IDT [ INTEGRATED DEVICE TECHNOLOGY ]
