IDT23S08E
3.3VZERODELAYCLOCKMULTIPLIER
COMMERCIALANDINDUSTRIALTEMPERATURERANGES
PINCONFIGURATION
ABSOLUTEMAXIMUMRATINGS(1)
Symbol
Rating
Max.
–0.5to+4.6
–0.5to+5.5
–0.5to
Unit
V
VDD
SupplyVoltageRange
InputVoltageRange(REF)
InputVoltageRange
(except REF)
(2)
VI
VI
V
1
2
16
15
14
13
12
REF
FBK
V
CLKA1
CLKA4
CLKA3
VDD
VDD+0.5
–50
3
IIK (VI < 0)
IO
InputClampCurrent
ContinuousOutputCurrent
mA
mA
CLKA2
±50
4
5
6
VDD
(VO = 0 to VDD)
VDD or GND
TA = 55°C
(instillair)(3)
TSTG
GND
CLKB1
CLKB2
S2
GND
CLKB4
CLKB3
S1
ContinuousCurrent
±100
0.7
mA
W
MaximumPowerDissipation
11
10
9
7
8
StorageTemperatureRange
CommercialTemperature
Range
–65to+150
0 to +70
°C
°C
Operating
Temperature
Operating
Temperature
NOTES:
IndustrialTemperature
Range
-40to+85
°C
SOIC/ TSSOP
TOP VIEW
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
2. The input and output negative-voltage ratings may be exceeded if the input and output
clamp-current ratings are observed.
3. The maximum package power dissipation is calculated using a junction temperature
PINDESCRIPTION
of 150°C and a board trace length of 750 mils.
Pin Number
FunctionalDescription
REF (1)
CLKA1(2)
CLKA2(2)
VDD
1
2
InputReferenceClock,5VoltTolerantInput
Clock Output for Bank A
Clock Output for Bank A
3.3V Supply
3
4
GND
5
Ground
CLKB1(2)
CLKB2(2)
S2(3)
6
Clock Output for Bank B
Clock Output for Bank B
Select Input, Bit 2
APPLICATIONS:
• SDRAM
• Telecom
7
8
S1(3)
9
Select Input, Bit 1
• Datacom
• PC Motherboards/Workstations
• Critical Path Delay Designs
CLKB3(2)
CLKB4(2)
GND
10
11
12
13
14
15
16
Clock Output for Bank B
Clock Output for Bank B
Ground
VDD
3.3V Supply
CLKA3(2)
CLKA4(2)
FBK
Clock Output for Bank A
Clock Output for Bank A
PLLFeedbackInput
NOTES:
1. Weak pull down.
2. Weak pull down on all outputs.
3. Weak pull ups on these inputs.
2
IDT [ INTEGRATED DEVICE TECHNOLOGY ]
