ICS556-04
L
OW
S
KEW
1
TO
4 C
LOCK
B
UFFER
Package Outline and Package Dimensions
(8-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
8
Inches
Min
Max
Symbol
Min
Max
A
A1
E
INDEX
AREA
H
1.35
0.10
0.33
0.19
4.80
3.80
5.80
0.25
0.40
0
°
h x 45
1.75
0.25
0.51
0.25
5.00
4.00
6.20
0.50
1.27
8
°
.0532
.0040
.013
.0075
.1890
.1497
.2284
.010
.016
0
°
.0688
.0098
.020
.0098
.1968
.1574
.2440
.020
.050
8
°
B
C
D
E
e
H
h
L
α
1 2
D
1.27 BASIC
0.050 BASIC
A
A1
C
-C-
e
B
SEATING
PLANE
L
.10 (.004)
C
Ordering Information
Part / Order Number
ICS556M-04I
ICS556M-04IT
ICS556M-04ILF
ICS556M-04ILFT
Marking
556M-04I
556M-04I
556M04IL
556M04IL
Shipping Packaging
Tubes
Tape and Reel
Tubes
Tape and Reel
Package
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
Temperature
-40 to +85°C
-40 to +85°C
-40 to +85°C
-40 to +85°C
“LF” denotes Pb free package.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any
circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or
critical medical instruments.
MDS 556-04 C
In te grated Circuit Systems
●
6
525 Ra ce Street, San Jose, CA 9512 6
●
Revision 030905
tel (4 08) 297-1 201
●
w w w. i c s t . c o m
ICS [ INTEGRATED CIRCUIT SYSTEMS ]
