iC-MH
12 BIT ANGULAR HALL ENCODER
Rev B1, Page 3/23
ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item Symbol
No.
Parameter
Conditions
Unit
Min.
-0.3
-0.3
-0.3
Max.
G001 V()
Supply voltages at VPA, VPD
Zapping voltage
6
8
6
V
V
V
G002 V(VZAP)
G003 V()
Voltages at A, B, Z, U, V, W, MA, SLO,
SLI, NERR, PTE
G004 I()
G005 I()
G006 I()
G007 I()
G008 Vd()
G009 Ts
G010 Tj
Current in VPA
-10
-20
20
200
100
10
mA
mA
mA
mA
kV
Current in VPD
Current in A, B, Z, U, V, W
Current in MA, SLO, SLI, NERR, PTE
ESD-voltage, all pins
Storage temperature
Chip temperature
-100
-10
HBM 100 pF discharged over 1.5 kΩ
2
-40
-40
150
135
°C
°C
THERMAL DATA
Operating conditions: VPA, VPD = 5 V ±10 %
Item Symbol
No.
Parameter
Conditions
Unit
Min. Typ. Max.
-40 125
T01 Ta
Ambient temperature
°C
T02 Rthja
Thermal resistance chip/ambient
package mounted on PCB, thermal pad at
40
K/W
approx. 2 cm² cooling area
All voltages are referenced to ground unless otherwise stated.
All currents into the device pins are positive; all currents out of the device pins are negative.