iC-MFL / iC-MFLT
8-/12-FOLD FAIL-SAFE LOGIC N-FET DRIVER
Rev C1, Page 3/13
PIN CONFIGURATION QFN24
4 mm x 4 mm to JEDEC MO220
PIN FUNCTIONS
No. Name Function
1 OUT1 5 V Output channel 1
2 -
3 -
(n.c.)
(n.c.)
4 GNDR Ground (Resistor)
5 VCC 5 V Supply Voltage
6 IN1
7 IN2
8 IN3
9 IN4
10 IN5
11 IN6
12 IN7
13 IN8
14 -
Input channel 1
Input channel 2
Input channel 3
Input channel 4
Input channel 5
Input channel 6
Input channel 7
Input channel 8
(n.c.)
15 EN
16 -
Enable Input
(n.c.)
17 GND Ground
18 OUT8 5 V Output channel 8
19 OUT7 5 V Output channel 7
20 OUT6 5 V Output channel 6
21 OUT5 5 V Output channel 5
22 OUT4 5 V Output channel 4
23 OUT3 5 V Output channel 3
24 OUT2 5 V Output channel 2
TP
Thermal-Pad
The Thermal Pad is to be connected to a ground plane on the PCB. Connections between GND, GNDR and the
ground plane should be conciled to system FMEA aspects.
ICHAUS [ IC-HAUS GMBH ]
