iC-HT
DUAL CW LASER DIODE DRIVER
nar y
limi
pre
Rev A1, Page 5/42
ABSOLUTE MAXIMUM RATINGS
These ratings do not imply permissible operating conditions; functional operation is not guaranteed. Exceeding these ratings may damage
the device.
Item
No.
Symbol
Parameter
Voltage at VB
Current in VB
Voltage at VDD
Current in VDD
Voltage at CI1, CI2, EC1, EC2, MDA1,
MDA2, EMC, SCLK/SCL, MISO/SDA,
MOSI/A0, NCS/A1, DCO, INS/WKR,
NCHK
Current in CI1, CI2, EC1, EC2, MDA1,
MDA2, EMC, SCLK/SCL, MISO/SDA,
MOSI/A0, NCS/A1, DCO, INS/WKR,
NCHK, NSTBY, CIL1, CIL2, MRL1,
MRL2
Current in LDK1, LDK2
Voltage at LDK1, LDK2, NSTBY
Voltage at AGND1, AGND2
Current in AGND1, AGND2
ESD Susceptibility at all pins
Operating Junction Temperature
Storage Temperature Range
DC current
HBM 100 pF discharged through 1.5 kΩ
-40
-40
DC current
Conditions
Min.
-0.3
-20
-0.3
-20
-0.3
Max.
8
50
5.5
1
5.5
V
mA
V
mA
V
Unit
G001 VB
G002 I(VB)
G003 VDD
G004 I(VDD)
G005 V()
G006 I()
-20
20
mA
G007 I(LDK)
G008 V()
G009 V()
G010 I(AGND)
G011 Vd()
G012 Tj
G013 Ts
-20
-0.3
-0.3
-900
900
8
1
1
2
125
150
mA
V
V
mA
kV
°C
°C
THERMAL DATA
Operating Conditions: VB = 2.8 . . . 8 V (referenced to GND)
Item
No.
T01
T02
T03
Symbol
Ta
Rthja
RthjTP
Parameter
Operating Ambient Temperature Range
Thermal Resistance Chip/Ambient
Thermal Resistance Chip/Thermal Pad
Mounted on PCB
Conditions
Min.
-40
25
4
Typ.
Max.
85
°C
K/W
K/W
Unit
All voltages are referenced to ground unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.