iC-HG
3 A LASER SWITCH
nar y
limi
pre
Rev A1, Page 3/19
PACKAGES QFN28 5 mm x 5 mm to JEDEC
PIN CONFIGURATION QFN28 5 mm x 5 mm
PIN FUNCTIONS
No. Name Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CI1
CI2
CI3
GND
CI4
CI5
CI6
AGND6
LDK6
AGND5
LDK5
AGND4
LDK4
EN6
Current control voltage channel 1
Current control voltage channel 2
Current control voltage channel 3
Ground
Current control voltage channel 4
Current control voltage channel 5
Current control voltage channel 6
Analog ground channel 6
Laser diode cathode channel 6
Analog ground channel 5
Laser diode cathode channel 5
Analog ground channel 4
Laser diode cathode channel 4
TTL switching input channel 6
Negative LVDS Input channel 5 and 6
TTL switching input channel 5
Positive LVDS Input channel 5 and 6
TTL switching input channel 4
Negative LVDS Input channel 3 and 4
TTL switching input channel 3
Positive LVDS Input channel 3 and 4
Supply voltage
TTL/LVDS Fast/Slow Input selector
TTL switching input channel 2
Negative LVDS Input channel 1 and 2
TTL switching input channel 1
Positive LVDS Input channel 1 and 2
Error monitor output
Laser diode cathode channel 3
Analog ground channel 3
Laser diode cathode channel 2
Analog ground channel 2
Laser diode cathode channel 1
Analog ground channel 1
28
27
26
25
24
23
22
1
2
3
4
5
6
7
21
20
19
HG
code...
...
18
17
16
15
15 EN5
8
9
10
11
12
13
14
16 EN4
17 EN3
18 VDD
19 ELVDS
20 EN2
21 EN1
22
23
24
25
26
27
28
NER
LDK3
AGND3
LDK2
AGND2
LDK1
AGND1
The
Thermal Pad
is to be connected to a
Ground Plane
(GND, AGND1. . . 6) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation ( HG label and coding is subject
to change).
ICHAUS [ IC-HAUS GMBH ]
