iC-HG
3 A LASER SWITCH
Rev A2, Page 3/21
PACKAGES QFN28 5 mm x 5 mm to JEDEC
PIN CONFIGURATION QFN28 5 mm x 5 mm
PIN FUNCTIONS
No. Name Function
1 CI1
2 CI2
3 CI3
4 GND
5 CI4
6 CI5
7 CI6
Current control voltage channel 1
Current control voltage channel 2
Current control voltage channel 3
Ground
Current control voltage channel 4
Current control voltage channel 5
Current control voltage channel 6
27
26
25
24
23
28
22
1
2
21
20
19
18
17
16
15
3
8 AGND6 Analog ground channel 6
9 LDK6 Laser diode cathode channel 6
10 AGND5 Analog ground channel 5
11 LDK5 Laser diode cathode channel 5
12 AGND4 Analog ground channel 4
13 LDK4 Laser diode cathode channel 4
14 EN6
15 EN5
16 EN4
17 EN3
18 VDD
4
5
6
7
HG
code...
...
TTL switching input channel 6
Negative LVDS Input channel 5 and 6
TTL switching input channel 5
Positive LVDS Input channel 5 and 6
TTL switching input channel 4
Negative LVDS Input channel 3 and 4
TTL switching input channel 3
Positive LVDS Input channel 3 and 4
Supply voltage
9
10
11
12
13
14
8
19 ELVDS TTL/LVDS Fast/Slow Input selector
20 EN2
21 EN1
22 NER
TTL switching input channel 2
Negative LVDS Input channel 1 and 2
TTL switching input channel 1
Positive LVDS Input channel 1 and 2
Error monitor output
23 LDK3 Laser diode cathode channel 3
24 AGND3 Analog ground channel 3
25 LDK2 Laser diode cathode channel 2
26 AGND2 Analog ground channel 2
27 LDK1 Laser diode cathode channel 1
28 AGND1 Analog ground channel 1
The Thermal Pad is to be connected to a Ground Plane (GND, AGND1. . . 6) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation ( HG label and coding is subject
to change).
ICHAUS [ IC-HAUS GMBH ]
