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IBMPPC750CLGEQ8023 参数 Datasheet PDF下载

IBMPPC750CLGEQ8023图片预览
型号: IBMPPC750CLGEQ8023
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 800MHz, CMOS, PBGA278, 21 X 21 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034, FCBGA-278]
分类和应用: 时钟外围集成电路
文件页数/大小: 70 页 / 981 K
品牌: IBM [ IBM ]
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Datasheet  
DD2.X  
PowerPC 750CL Microprocessor  
Preliminary  
In this example, let:  
T = 105°C maximum  
J
Ta = 50°C at heatsink = 35°C air inlet temperature plus 15°C internal temperature rise  
Pd = 6 W maximum at 105°C  
jc = 2°C/W  
cs = 0.5°C/W  
sa = unknown  
So  
105°C = 50°C + 6 W(2 + 0.5 + x°C/W)  
Thus  
sa 6.67°C/W  
Airflow at the heatsink is a minimum of 1 m/s. Considering the heatsink of Figure 5-10, thermal resistance at  
1 m/s airflow is less than 5.8°C/W, which satisfies the requirement with a reasonable engineering margin.  
Figure 5-10. Example of a Pin-Fin Heat-Sink-to-Ambient Thermal Resistance versus Airflow Velocity  
Example Pin-Fin Heat Sink  
(25 × 28 × 15 mm)  
8
7
6
5
4
3
2
1
0
0.5  
1
1.5  
2
2.5  
3
3.5  
Approach Air Velocity (m/s)  
System Design Information  
Page 62 of 70  
Version 2.5  
December 2, 2008