Datasheet
DD2.X
Preliminary
PowerPC 750CL Microprocessor
• An average failure rate (AFR) target of 100 failures in time (FIT) over a lifetime of 40 K POH
• An early failure rate (EFR) of 250 FIT during the first 8700 POH
FIT rates are averages and are computed to 70% confidence. For more information, see the latest IBM Burl-
ington Quality Monitor Report available on IBM CustomerConnect.
Figure 1-1 shows the calculated target AFR of the 750CL parts. The FIT rates in Figure 1-1 are defined as a
set of average use conditions that include the average junction temperature (T ), the average processor core
J
voltage (V ), and the average core frequency (F
) of the processor.
DD
CORE
Each processor is assumed to be operating with an average V equal to the nominal V for the part, as
DD
DD
shown in Section 1.3, Part Number Information, on page 12.
Note: The calculated FIT rate curves in Figure 1-1 are included for reference only. These curves are based
on the known characteristics of this technology; they are not guaranteed to accurately reflect the performance
of every population of 750CL parts.
Figure 1-1. Effect of Average Use Condition on Reliability
PPC 750CL
Average Failure Rate (AFR) 0-40,000 Power-On Hours (POH)
180
160
140
120
1 GHz
100
900 MHz
733/800 MHz
80
600 MHz
500 MHz
400 MHz
60
40
20
0
50
60
70
80O
90
100
)
Average Tj use (in C
1.4.1 Package Reliability
The lifetime of the 750CL can be reduced if it is exposed to an extreme number and severity of temperature
cycles.
Version 2.5
General Information
Page 13 of 70
December 2, 2008