Datasheet
PowerPC 970FX RISC Microprocessor
Table 3-2. Recommended Operating Conditions (Page 2 of 2)
Characteristic
I/O supply current, maximum
Symbol
Value
2
Unit
A
Notes
2
OI
V
DD
IN
Input voltage
GND to OV
0 to 105
V
DD
Thermal diode temperature
Notes:
T
°C
DIODE
1. The PLL supply voltage has been adjusted to account for the maximum possible dc drop across the filter circuit. See Section 5.3
PLL Power Supply Filtering on page 66.
2. This is the maximum I/O current. As noted in Table 3-7 Power Consumption Throttle Back F/2 on page 26, the actual I/O power
varies between 1 - 3 watts based on the speed of the processor interface (PI) and whether the on-board termination is used. Typi-
cally it is active, but in cases of the slower parts and layouts with parts in very close proximity, signal analysis might show that the
PI terminations can be turned off.
3.1.3 Package Thermal Characteristics
Table 3-3. Package Thermal Characteristics
Characteristic
Symbol
Value
0.1
Unit
°C/W
°C/W
Ceramic ball grid array (CBGA) thermal conductance to
back of die
θ
JC
CBGA thermal conductance to system board
θ
5.4
JB
Electrical and Thermal Characteristics
Page 22 of 78
Version 2.5
March 26, 2007
IBM [ IBM ]
