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IBM25PPC970FX6UB186ET 参数 Datasheet PDF下载

IBM25PPC970FX6UB186ET图片预览
型号: IBM25PPC970FX6UB186ET
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 64-Bit, 1600MHz, CMOS, CBGA576, 25 X 25 MM, 1 MM PITCH, CERAMIC, BGA-576]
分类和应用: 时钟外围集成电路
文件页数/大小: 78 页 / 3525 K
品牌: IBM [ IBM ]
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Datasheet  
PowerPC 970FX RISC Microprocessor  
List of Figures  
Figure 1-1. PowerPC 970FX Block Diagram ................................................................................................ 15  
Figure 1-2. Part Number Legend .................................................................................................................. 18  
Figure 3-1. Clock Differential HSTL Signal ................................................................................................... 27  
Figure 3-2. Processor-Clock Timing Relationship between PSYNC and SYSCLK ...................................... 29  
Figure 3-3. Block Diagram of an SSB for a Processor Interconnect Implementation ................................... 30  
Figure 3-4. Typical Implementation for a Single-Ended Line ........................................................................ 31  
Figure 3-5. Differential Clock Termination Circuitry ...................................................................................... 32  
Figure 3-6. Post-IAP Eye Opening ............................................................................................................... 33  
Figure 3-7. Asynchronous Input Timing ........................................................................................................ 35  
Figure 3-8. HRESET and BYPASS Timing Diagram .................................................................................... 38  
Figure 3-9. Spread Spectrum Clock Generator Modulation Profile .............................................................. 40  
Figure 3-10. JTAG Clock Input Timing Diagram ........................................................................................... 42  
Figure 3-11. Test Access Port Timing Diagram ............................................................................................ 43  
Figure 4-1. PowerPC 970FX Microprocessor Mechanical Package for Standard Lead DD3.0x Parts ........ 46  
Figure 4-2. PowerPC 970FX Microprocessor Mechanical Package for Standard Lead, DD3.1x Parts ....... 47  
Figure 4-3. PowerPC 970FX Microprocessor Bottom Dimensions for Standard Lead CBGA Package ....... 48  
Figure 4-4. PowerPC 970FX Microprocessor Mechanical Package for Reduced-Lead DD3.0x Parts ........ 50  
Figure 4-5. PowerPC 970FX Microprocessor Mechanical Package for Reduced-Lead DD3.1 Parts .......... 51  
Figure 4-6. PowerPC 970FX Microprocessor Bottom Dimensions for Reduced-Lead CBGA Package ....... 52  
Figure 4-7. PowerPC 970FX Ball Placement (Top View) ............................................................................. 53  
Figure 4-8. PowerPC 970FX Ball Placement (Bottom View) ........................................................................ 54  
Figure 5-1. PLL Power Supply Filter Circuit ................................................................................................. 66  
Figure 5-2. Decoupling Capacitor Locations ................................................................................................ 68  
Figure 5-3. PowerPC 970FX Thermal Diode Implementation ...................................................................... 76  
Figure 5-4. Force Diagram for the PowerPC 970FX Package ..................................................................... 77  
Version 2.5  
List of Figures  
Page 5 of 78  
March 26, 2007  
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