Datasheet
PowerPC 970FX RISC Microprocessor
Figure 4-3. PowerPC 970FX Microprocessor Bottom Dimensions for Standard Lead CBGA Package
Bottom View
Legend
1
2
3
DATUM A is the center plane of the feature labeled DATUM A.
DATUM B is the center plane of the feature labeled DATUM B.
Unless otherwise specified, the part is symmetrical about center lines defined by DATUMs A and B.
4.2.2 Reduced-Lead Package Version
This section describes the reduced-lead package, as indicated by the ‘R’ in the package code field of the part
number. For the reduced-lead package, lead-free solder is used for the substrate capacitors and the ball grid
array (BGA) balls on the bottom of the package. Standard high-melting-point 97% Pb and 3% Sn solder
(exempted by European Union restriction of hazardous substances [RoHS] legislation) is used for the C4
balls that interconnect the die to the substrate. The resulting module is RoHS compatible.
All datasheet electrical specifications apply equally to standard and reduced-lead parts.
Dimensions and Physical Signal Assignments
Page 48 of 78
Version 2.5
March 26, 2007
IBM [ IBM ]
