PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
Mechanical Dimensions of the PowerPC 750 360 CBGA Package
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature of the 360 CBGA Package
2X
0.2
Top View
NOTES:
A
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING FROM
THE ARRAY.
CAPACITOR
D1
MILLIMETERS
CHIP
E3
E2
DIM
A
Minimum
2.65
Maximum
3.20
E1
E
A1
A2
b
0.80
1.00
E2
E3
1.10
1.30
0.82
0.93
D
25.00 BSC
D1
D2
D3
e
5.443
2.48
D2
D3
D2
6.3
D3
1.27 BSC
25.00 BSC
8.075
E
2X
E1
E2
E3
0.2
A01 Corner Locator
2.48
B
7.43
A01 Corner
C
19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0.15
C
W
V
U
T
R
P
N
M
L
X-ray view of balls
from top of package
K
J
H
G
F
E
D
C
B
A
(18x)
e
There is no ball in the A01 position
(18x)
A2
A1
360X
b
A01 Corner
0.3 C A B
0.15
A
C
Not To Scale
Note: All caps on the SCM are lower in height than the processor die.
9/6/2002
Version 2.0
Page36
IBM [ IBM ]
