PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
PowerPC 740 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PowerPC 740, a 255 pin ceramic ball grid array
(BGA) package.
Figure 14 (in part A) shows the pinout of the PPC 740, a 255 pin Ceramic Ball Grid Array (CBGA) package as
viewed from the top surface. Part B shows the side profile.
Figure 14. Pinout of the 740 255 CBGA Package as Viewed from the Top Surface
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Part A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Not to Scale
Part B
View
Substrate Assembly.
Encapsulation
Die
Page 27
Version 2.0
9/6/2002
IBM [ IBM ]
