PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
60x Bus Output AC Specifications
The following table provides the 60x bus output AC timing specifications for the 750 as defined in Figure 6.
Output timing specification for the L2 bus are provided in the “L2 Bus Output AC Specifications,” on page 23.
60X Bus Output AC Timing Specifications for the 7501
2
See ”Recommended Operating Conditions,” on page 11 for operating conditions, C = 50pF
L
Num
Characteristic
All Frequencies
Unit
Notes
Minimum
Maximum
12
13
14
SYSCLK to Output Driven (Output Enable Time)
0.5
–
ns
ns
ns
8
5
5
SYSCLK to Output Valid (TS, ABB, ARTRY, DBB, and TBST)
4.5
5.0
SYSCLK to all other Output Valid (all except TS, ABB, ARTRY,
DBB, and TBST)
–
15
16
SYSCLK to Output Invalid (Output Hold)
1.0
–
ns
ns
3, 8, 9
8
SYSCLK to Output High Impedance (all signals except ABB,
ARTRY, and DBB)
6.0
17
18
19
20
21
SYSCLK to ABB and DBB high impedance after precharge
SYSCLK to ARTRY high impedance before precharge
SYSCLK to ARTRY precharge enable
–
1.0
5.5
tSYSCLK
ns
4, 6, 8
8
–
0.2×tSYSCLK + 1.0
ns
3, 4, 7
4, 7
Maximum delay to ARTRY precharge
1
2
tSYSCLK
tSYSCLK
SYSCLK to ARTRY high impedance after precharge
4, 7, 8
Note:
1. All output specifications are measured from Vm of the rising edge of SYSCLK to Vm of the signal in question. Both input and output timings are mea-
sured at the pin.
2. All maximum timing specifications assume CL = 50pF.
3. This minimum parameter assumes CL = 0pF.
4. tSYSCLK is the period of the external bus clock (SYSCLK) in nanoseconds (ns). The numbers given in the table must be multiplied by the period of
SYSCLK to compute the actual time duration of the parameter in question.
5. This footnote has been deleted.
6. Nominal precharge width for ABB and DBB is 0.5 tSYSCLK
7. Nominal precharge width for ARTRY is 1.0 tSYSCLK
.
.
8. Guaranteed by design and characterization, and not tested.
9. Connecting L2_TSTCLK to GND no longer provides additional Output Hold. For new designs, L2_TSTCLK should be pulled up to OVDD, but it can be
left connected to GND in Legacy systems.
9/6/2002
Version 2.0
Page18
IBM [ IBM ]
