PowerPC 750 SCM RISC Microprocessor
PID8p-750
Preliminary Copy
Mechanical Dimensions of the 360 CBGA Package
Figure 14 provides the mechanical dimensions and bottom surface nomenclature of the 360 CBGA package.
Figure 14. Mechanical Dimensions and Bottom Surface Nomenclature of the 360 CBGA Package
2X
0.2
NOTES:
1.
A
D
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2.
3.
DIMENSIONS IN MILLIMETERS.
TOP SIDE A1 CORNER INDEX IS A METALIZED
FEATURE WITH VARIOUS SHAPES. BOTTOM SIDE A1
CORNER IS DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
CAPACITOR
D1
MILLIMETERS
DIM
A
Minimum
2.65
Maximum
3.20
CHIP
E3
E2
A1
A2
b
0.80
1.00
1.10
1.30
E1
0.82
0.93
E
E2
E3
D
25.00 BSC
D1
D2
D3
e
5.443
2.48
6.3
1.27 BSC
25.00 BSC
8.075
D2
D3
D2
E
D3
E1
E2
E3
F1
F2
2.48
2X
7.43
0.2
0.51
0.75
0.61
0.90
A01 Corner Locator
B
A01 Corner
C
0.15
C
1
2
3
4
5
6
7
8 9 10 11 12 13 14 15 16 17 18 19
F2
F1
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
(18x)
e
(18x)
360X
b
A2
A1
0.3 C A B
C
0.15
A
Not To Scale
Note: All caps on the SCM are lower in height than the processor die.
Page 28
Version 2.0
Datasheet
9/30/99
IBM [ IBM ]
