PowerPC 750 SCM RISC Microprocessor
PID8p-750
Preliminary Copy
General Parameters
The following list provides a summary of the general parameters of the PID8p-750.
Technology
0.20µm CMOS (general lithography), six-layer copper metallization
0.12 ± 0.04µm Leff
2
Die Size
5.14mm x 7.78mm (40mm )
Transistor count
Logic design
Package
6.35 million
Fully-static
PID8p-750: Surface mount 360-lead ceramic ball grid array (CBGA) with L2
interface.
Core power supply
I/O power supply
2.05 ± 50mVDC
3.3V ± 5%
2.5V ± 5%
1.8V ± 5%
9/30/99
Version 2.0
Datasheet
Page 5