PowerPC 750 SCM RISC Microprocessor
PID8p-750
Preliminary Copy
PowerPC PID8p-750 Microprocessor Pinout Listings
The following table provides the pinout listing for the 360 CBGA package (the PID8p-750).
5
Pinout Listing for the 360 CBGA package
Signal Name
A0-A31
Pin Number
Active
High
I/O
I/O
A13, D2, H11, C1, B13, F2, C13, E5, D13, G7, F12, G3, G6, H2, E2,
L3, G5, L4, G4, J4, H7, E1, G2, F3, J7, M3, H3, J2, J6, K3, K2, L2
AACK
ABB
N3
Low
Low
High
Input
I/O
L7
8
C4, C5, C6, C7
I/O
AP0-AP3
ARTRY
L6
A8
Low
—
I/O
—
9
AVDD
BG
H1
E7
D7
C2
B8
E3
K5
G1
K1
D1
Low
Low
Low
Low
Low
--
Input
Output
Output
Output
Input
Output
I/O
BR
CKSTP_OUT
CI
CKSTP_IN
CLKOUT
DBB
Low
Low
Low
Low
High
DBDIS
DBG
Input
Input
Input
I/O
DBWO
DH0-DH31
W12, W11, V11, T9, W10, U9, U10, M11, M9, P8, W7, P9, W9, R10,
W6, V7, V6, U8, V9, T7, U7, R7, U6, W5, U5, W4, P7, V5, V4, W3,
U4, R5
DL0-DL31
M6, P3, N4, N5, R3, M7, T2, N6, U2, N7, P11, V13, U12, P12, T13,
W13, U13, V10, W8, T11, U11, V12, V8, T1, P1, V1, U1, N1, R2, V3,
U3, W2
High
High
I/O
I/O
8
L1, P2, M2, V2, M1, N2, T3, R1
DP0-DP7
DRTRY
GBL
H6
B1
Low
Low
Input
I/O
Note:
1. These are test signals for factory use only and must be pulled up to OVDD for normal machine operation.
2. OVDD inputs supply power to the I/O drivers and VDD inputs supply power to the processor core.
3. Internally tied to L2OVDD in the PID8p-750 360 CBGA package. This is NOT a supply pin.
4. These pins are reserved for potential future use as additional L2 address pins.
5. Pull up and pull down resistor requirements for all pins are listed in the “Pull-up / Pull-down Resistor Requirements” section on page 33
6. BVSEL selects the I/O voltage on the 60X bus. L2VSEL selects the I/O voltage on the L2 bus. Please refer to the Table “Recommended Operating
Conditions1,2,3,” on page 6, for the use of these pins.
7. TCK must be tied high or low for normal machine operation.
8. Address and data parity signals must be tied high or low if unused in the design.
9. Starting with rev levels dd3.X, the AVDD pin is no longer brought out to the package.
Page 24
Version 2.0
Datasheet
9/30/99
IBM [ IBM ]
