欢迎访问ic37.com |
会员登录 免费注册
发布采购

IBM25PPC750CXRKQ1024T 参数 Datasheet PDF下载

IBM25PPC750CXRKQ1024T图片预览
型号: IBM25PPC750CXRKQ1024T
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 366MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256]
分类和应用: 时钟外围集成电路
文件页数/大小: 43 页 / 402 K
品牌: IBM [ IBM ]
 浏览型号IBM25PPC750CXRKQ1024T的Datasheet PDF文件第1页浏览型号IBM25PPC750CXRKQ1024T的Datasheet PDF文件第2页浏览型号IBM25PPC750CXRKQ1024T的Datasheet PDF文件第4页浏览型号IBM25PPC750CXRKQ1024T的Datasheet PDF文件第5页浏览型号IBM25PPC750CXRKQ1024T的Datasheet PDF文件第6页浏览型号IBM25PPC750CXRKQ1024T的Datasheet PDF文件第7页浏览型号IBM25PPC750CXRKQ1024T的Datasheet PDF文件第8页浏览型号IBM25PPC750CXRKQ1024T的Datasheet PDF文件第9页  
Data Sheet  
PowerPC® 750CXr RISC Microprocessor  
Contents  
1. General Information .................................................................................................... 9  
1.1 Features ........................................................................................................................................... 9  
1.2 Special Design Level Considerations/Features ......................................................................... 11  
1.3 Ordering Information .................................................................................................................... 11  
1.4 Processor Version Register (PVR) .............................................................................................. 12  
2. Overview .................................................................................................................... 13  
2.1 PowerPC 750CXr Block Diagram ................................................................................................. 13  
3. General Parameters .................................................................................................. 14  
4. Electrical and Thermal Characteristics ................................................................... 15  
4.1 DC Electrical Characteristics ....................................................................................................... 15  
4.2 AC Electrical Characteristics ....................................................................................................... 19  
4.2.1 Clock AC Specifications ........................................................................................................ 19  
4.3 Spread Spectrum Clock Generator (SSCG) ................................................................................ 20  
4.4 60x Bus Input AC Specifications ................................................................................................. 21  
4.5 60x Bus Output AC Specifications .............................................................................................. 22  
4.5.1 IEEE 1149.1 AC Timing Specifications ................................................................................. 25  
5. PowerPC 750CXr Dimension and Physical Signal Assignments ......................... 27  
6. System Design Information ..................................................................................... 35  
6.1 PLL Configuration ......................................................................................................................... 35  
6.2 PLL Power Supply Filtering ......................................................................................................... 36  
6.3 Decoupling Recommendations ................................................................................................... 36  
6.4 Connection Recommendations ................................................................................................... 37  
6.5 Output Buffer DC Impedance ....................................................................................................... 37  
6.5.1 Input-Output Usage ............................................................................................................... 38  
6.6 Thermal Management Information .............................................................................................. 41  
6.6.1 Thermal Assist Unit ............................................................................................................... 41  
6.6.2 Heat Sink Considerations ...................................................................................................... 41  
6.6.3 Internal Package Conduction Resistance .............................................................................. 42  
6.7 Operational and Design Considerations ..................................................................................... 42  
6.7.1 Level Protection ..................................................................................................................... 42  
6.7.2 64- or 32-Bit Data Bus Mode ................................................................................................. 43  
6.7.3 60x Bus Operation ................................................................................................................. 43  
6.7.4 DBWO/L2_TSTCLK ............................................................................................................... 43  
6.7.5 CHKSTP_OUT/CLKOUT ....................................................................................................... 43  
Revision Log ................................................................................................................ 45  
sw_ds_750cxrTOC.fm  
February 28, 2005  
Page 3 of 43  
 复制成功!