Preliminary
PowerPC 405GPr Embedded Processor Data Sheet
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device
Characteristic
Supply Voltage (Internal Logic)
Symbol
Value
Unit
V
V
0 to +1.95
0 to +3.6
0 to +1.95
DD
OV
Supply Voltage (I/O Interface)
V
DD
AV
PLL Supply Voltage
V
DD
V
-0.6 to V + 0.45
Input Voltage (1.8V CMOS receivers)
Input Voltage (3.3V LVTTL receivers)
Input Voltage (5.0V LVTTL receivers)
Storage Temperature Range
V
IN
DD
V
-0.6 to OV + 0.6
V
IN
DD
V
-0.6 to OV + 2.4
V
IN
DD
T
-55 to +150
-40 to +120
°C
°C
STG
T
Case temperature under bias
C
Note: All specified voltages are with respect to GND.
Package Thermal Specifications
The PPC405GPr is designed to operate within a case temperature range of -40°C to +85°C. Thermal resistance values
for the E-PBGA packages in a convection environment are as follows:
Airflow
ft/min (m/sec)
Symbol
Package—Thermal Resistance
Unit
0 (0)
100 (0.51)
200 (1.02)
35mm, 456-balls—Junction-to-Case
θJC
θCA
θJC
θCA
2
2
2
°C/W
°C/W
°C/W
°C/W
1
14
2
13
2
12
2
35mm, 456-balls—Case-to-Ambient
27mm, 456-balls—Junction-to-Case
1
18
16
15
27mm, 456-balls—Case-to-Ambient
Note:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, T , is measured at top center of case surface with device soldered to circuit board.
C
b. T = T – P×θCA, where T is ambient temperature and P is power consumption.
A
C
A
c. TCMax = TJMax – P×θJC, where TJMax is maximum junction temperature and P is power consumption.
38
IBM [ IBM ]
