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IBM25PPC405GP-3EE266CZ 参数 Datasheet PDF下载

IBM25PPC405GP-3EE266CZ图片预览
型号: IBM25PPC405GP-3EE266CZ
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 266.66MHz, CMOS, PBGA413, 25 X 25 MM, ENHANCED, PLASTIC, BGA-413]
分类和应用: 时钟外围集成电路
文件页数/大小: 60 页 / 1410 K
品牌: IBM [ IBM ]
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PowerPC 405GP Embedded Processor Data Sheet
Features
• IBM PowerPC
405 32-bit RISC processor core
operating up to 266MHz
• Synchronous DRAM (SDRAM) interface
operating up to 133MHz
- 32-bit interface for non-ECC applications
- 40-bit interface serves 32 bits of data plus 8
check bits for ECC applications
• 4KB on-chip memory (OCM)
• External peripheral bus
- Flash ROM/Boot ROM interface
- Direct support for 8-, 16-, or 32-bit SRAM
and external peripherals
- Up to eight devices
- External Mastering supported
• DMA support for external peripherals, internal
UART and memory
- Scatter-gather chaining supported
- Four channels
• PCI Revision 2.2 compliant interface (32-bit, up
to 66MHz)
- Synchronous or asynchronous PCI Bus
interface
- Internal or external PCI Bus Arbiter
• Ethernet 10/100Mbps (full-duplex) support with
media independent interface (MII)
• Programmable interrupt controller supports
seven external and 19 internal edge triggered or
level-sensitive interrupts
• Programmable timers
• Two serial ports (16550 compatible UART)
• One IIC interface
• General purpose I/O (GPIO) available
• Supports JTAG for board level testing
• Internal processor local Bus (PLB) runs at
SDRAM interface frequency
• Supports PowerPC processor boot from PCI
memory
Description
Designed specifically to address embedded
applications, the PowerPC 405GP (PPC405GP)
provides a high-performance, low-power solution
that interfaces to a wide range of peripherals by
incorporating on-chip power management features
and lower power dissipation requirements.
This chip contains a high-performance RISC
processor core, SDRAM controller, PCI bus
interface, Ethernet interface, control for external
ROM and peripherals, DMA with scatter-gather
support, serial ports, IIC interface, and general
purpose I/O.
Technology: IBM CMOS SA-12E, 0.25
µ
m
(0.18
µ
m L
eff
)
Package: 456-ball (35mm or 27mm), or 413-ball
(25mm) enhanced plastic ball grid array (E-PBGA)
Power (typical): TBDW at 133MHz, 1.5W at
200MHz, 2W at 266MHz
6/20/03
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