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IBM25EMPPC750LEBC3000 参数 Datasheet PDF下载

IBM25EMPPC750LEBC3000图片预览
型号: IBM25EMPPC750LEBC3000
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用: 时钟外围集成电路
文件页数/大小: 50 页 / 600 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Embedded Microprocessor  
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L  
Table of Contents  
Preface .....................................................................................................................................................1  
Overview ...................................................................................................................................................1  
Features ...................................................................................................................................................3  
General Parameters .................................................................................................................................6  
Electrical and Thermal Characteristics .....................................................................................................7  
DC Electrical Characteristics ................................................................................................................7  
AC Electrical Characteristics ..................................................................................................................11  
Clock AC Specifications ......................................................................................................................11  
60x Bus Input AC Specifications .........................................................................................................12  
60x Bus Output AC Specifications ......................................................................................................14  
L2 Clock AC Specifications .................................................................................................................16  
L2 Bus Input AC Specifications ...........................................................................................................18  
L2 Bus Output AC Specifications ........................................................................................................19  
IEEE 1149.1 AC Timing Specifications ..................................................................................................20  
PowerPC 740 Microprocessor Pin Assignments ....................................................................................22  
PowerPC 740 Microprocessor Pinout Listings .......................................................................................23  
PowerPC 740 Package ..........................................................................................................................26  
Mechanical Dimensions of the 255 CBGA Package ...........................................................................27  
PowerPC 750 Microprocessor Pin Assignments ....................................................................................28  
PowerPC 750 Package ..........................................................................................................................32  
Mechanical Dimensions of the 360 CBGA Package........................................................................... 33  
System Design Information ....................................................................................................................35  
PLL Configuration ...............................................................................................................................35  
PLL Power Supply Filtering .................................................................................................................36  
Decoupling Recommendations ...........................................................................................................36  
Connection Recommendations ...........................................................................................................36  
Output Buffer DC Impedance ..............................................................................................................37  
Pull-up Resistor Requirements ...........................................................................................................38  
Thermal Management Information ......................................................................................................39  
Internal Package Conduction Resistance ...........................................................................................40  
Heat Sink Selection Example ..............................................................................................................43  
Ordering Information ...............................................................................................................................45  
5/20/99  
Version 1.51  
PowerPC 740 and PowerPC 750 Datasheet  
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