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IBM25EMPPC750LEBB4660 参数 Datasheet PDF下载

IBM25EMPPC750LEBB4660图片预览

型号：	IBM25EMPPC750LEBB4660
PDF下载：	下载PDF文件查看货源
内容描述：	[RISC Microprocessor, 32-Bit, 466MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用：	时钟外围集成电路
文件页数/大小：	50 页 / 600 K
品牌：	IBM [ IBM ]

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PowerPC 740 and PowerPC 750 Embedded Microprocessor

IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L

Table of Contents

Preface ..................................................................................................................................................... 1

Overview ................................................................................................................................................... 1

Features ................................................................................................................................................... 3

General Parameters ................................................................................................................................. 6

Electrical and Thermal Characteristics ..................................................................................................... 7

DC Electrical Characteristics ................................................................................................................ 7

AC Electrical Characteristics .................................................................................................................. 11

Clock AC Specifications ...................................................................................................................... 11

60x Bus Input AC Specifications ......................................................................................................... 12

60x Bus Output AC Specifications ...................................................................................................... 14

L2 Clock AC Specifications ................................................................................................................. 16

L2 Bus Input AC Specifications ........................................................................................................... 18

L2 Bus Output AC Specifications ........................................................................................................ 19

IEEE 1149.1 AC Timing Specifications .................................................................................................. 20

PowerPC 740 Microprocessor Pin Assignments .................................................................................... 22

PowerPC 740 Microprocessor Pinout Listings ....................................................................................... 23

PowerPC 740 Package .......................................................................................................................... 26

Mechanical Dimensions of the 255 CBGA Package ........................................................................... 27

PowerPC 750 Microprocessor Pin Assignments .................................................................................... 28

PowerPC 750 Package .......................................................................................................................... 32

Mechanical Dimensions of the 360 CBGA Package........................................................................... 33

System Design Information .................................................................................................................... 35

PLL Configuration ............................................................................................................................... 35

PLL Power Supply Filtering ................................................................................................................. 36

Decoupling Recommendations ........................................................................................................... 36

Connection Recommendations ........................................................................................................... 36

Output Buffer DC Impedance .............................................................................................................. 37

Pull-up Resistor Requirements ........................................................................................................... 38

Thermal Management Information ...................................................................................................... 39

Internal Package Conduction Resistance ........................................................................................... 40

Heat Sink Selection Example .............................................................................................................. 43

Ordering Information ............................................................................................................................... 45

5/20/99

Version 1.51

PowerPC 740 and PowerPC 750 Datasheet

Page iii

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