PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
PowerPC 750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the 750. IBM offers a ceramic ball grid array 360
CBGA packages.
Figure 15 (in part A) shows the pinout of the 360 CBGA package as viewed from the top surface. Part B
shows the side profile of the 360 CBGA package to indicate the direction of the top surface view.
Figure 15. Pinout of the 750 360 CBGA Package as Viewed from the Top Surface
17
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
18 19
Part A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Part B
W
Not to Scale
View
Substrate Assembly.
Encapsulation
Die
Page 28
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
IBM [ IBM ]
