PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Table of Contents
Preface .....................................................................................................................................................1
Overview ...................................................................................................................................................1
Features ...................................................................................................................................................3
General Parameters .................................................................................................................................6
Electrical and Thermal Characteristics .....................................................................................................7
DC Electrical Characteristics ................................................................................................................7
AC Electrical Characteristics ..................................................................................................................11
Clock AC Specifications ......................................................................................................................11
60x Bus Input AC Specifications .........................................................................................................12
60x Bus Output AC Specifications ......................................................................................................14
L2 Clock AC Specifications .................................................................................................................16
L2 Bus Input AC Specifications ...........................................................................................................18
L2 Bus Output AC Specifications ........................................................................................................19
IEEE 1149.1 AC Timing Specifications ..................................................................................................20
PowerPC 740 Microprocessor Pin Assignments ....................................................................................22
PowerPC 740 Microprocessor Pinout Listings .......................................................................................23
PowerPC 740 Package ..........................................................................................................................26
Mechanical Dimensions of the 255 CBGA Package ...........................................................................27
PowerPC 750 Microprocessor Pin Assignments ....................................................................................28
PowerPC 750 Package ..........................................................................................................................32
Mechanical Dimensions of the 360 CBGA Package........................................................................... 33
System Design Information ....................................................................................................................35
PLL Configuration ...............................................................................................................................35
PLL Power Supply Filtering .................................................................................................................36
Decoupling Recommendations ...........................................................................................................36
Connection Recommendations ...........................................................................................................36
Output Buffer DC Impedance ..............................................................................................................37
Pull-up Resistor Requirements ...........................................................................................................38
Thermal Management Information ......................................................................................................39
Internal Package Conduction Resistance ...........................................................................................40
Heat Sink Selection Example ..............................................................................................................43
Ordering Information ...............................................................................................................................45
5/20/99
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
Page iii
IBM [ IBM ]
