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IBM25CPC945CQ3C-1 参数 Datasheet PDF下载

IBM25CPC945CQ3C-1图片预览
型号: IBM25CPC945CQ3C-1
PDF下载: 下载PDF文件 查看货源
内容描述: [Micro Peripheral IC, CMOS, PBGA1182,]
分类和应用:
文件页数/大小: 69 页 / 1861 K
品牌: IBM [ IBM ]
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Datasheet  
Preliminary  
CPC945 Bridge and Memory Controller  
Figure 4-2. FC-PBGA Package (Top and Side Views)  
Cover Plate  
)
(
35.5  
37.5  
(1)  
A
)
(
B
A01 corner  
0.25  
C
Solderball 4  
Cover Plate  
0.35  
C
Laminate  
Sylgard  
0.1  
E
D
2
H4  
A
A
Notes:1 Package conforms to JEDEC SPEC. MS-034. With the exception of note 4.  
2 Copper-to-copper thickness.  
0.2  
C
C
3 In the case where the edge deflection is toward the laminate, the plate flatness is to be less than or  
equal to 0.254 mm.  
4 Indicated feature does not conform to JEDEC MS-034.  
This side  
A15-6009-03  
December 18, 2007 - IBM Confidential  
Dimensions and Pin Information  
Page 33 of 69