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IBM25CPC945CQ3C-1 参数 Datasheet PDF下载

IBM25CPC945CQ3C-1图片预览
型号: IBM25CPC945CQ3C-1
PDF下载: 下载PDF文件 查看货源
内容描述: [Micro Peripheral IC, CMOS, PBGA1182,]
分类和应用:
文件页数/大小: 69 页 / 1861 K
品牌: IBM [ IBM ]
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Datasheet  
CPC945 Bridge and Memory Controller  
Preliminary  
Table 2-2 and Figure 2-2 describe the allowable forces for the CPC945 package. The heat sink design must  
not exceed these static or dynamic forces.  
Table 2-2. Allowable Forces on the CPC945 Package  
Callout  
Number  
Characteristic  
Symbol  
FC  
Maximum  
Unit1  
Note  
Static  
0.53  
39  
N
N
N
N
N
N
N
N
2
2
2
2
1
Compressive force on the die  
Dynamic  
Static  
0.53  
N/A  
463  
3.48  
0.57  
N/A  
2
3
Tensile force on the die  
FT  
FBGA  
FT  
Dynamic  
Static  
Compressive force on the ball grid array (BGA) balls  
Tensile force on the BGA balls  
Dynamic  
Static  
3
4
Dynamic  
Note:  
1. One newton = 0.2248089 pound-force.  
2. This force might be limited by the BGA limit.  
3. The maximum force value for callout item 3 must include the force value for callout item 1.  
Figure 2-2. Force Diagram for the CPC945 Package  
2
1
3
4
die  
Note: The legend for this figure is provided by callout number in Table 2-2.  
Overview  
A15-6009-03  
December 18, 2007 - IBM Confidential  
Page 20 of 69