欢迎访问ic37.com |
会员登录 免费注册
发布采购

IBM25403GCX-3JC66C2 参数 Datasheet PDF下载

IBM25403GCX-3JC66C2图片预览
型号: IBM25403GCX-3JC66C2
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 66MHz, CMOS, PQFP160, PLASTIC, QFP-160]
分类和应用: 时钟外围集成电路
文件页数/大小: 56 页 / 489 K
品牌: IBM [ IBM ]
 浏览型号IBM25403GCX-3JC66C2的Datasheet PDF文件第18页浏览型号IBM25403GCX-3JC66C2的Datasheet PDF文件第19页浏览型号IBM25403GCX-3JC66C2的Datasheet PDF文件第20页浏览型号IBM25403GCX-3JC66C2的Datasheet PDF文件第21页浏览型号IBM25403GCX-3JC66C2的Datasheet PDF文件第23页浏览型号IBM25403GCX-3JC66C2的Datasheet PDF文件第24页浏览型号IBM25403GCX-3JC66C2的Datasheet PDF文件第25页浏览型号IBM25403GCX-3JC66C2的Datasheet PDF文件第26页  
IBM PowerPC 403GCX  
Package Thermal Specifications  
Operating Conditions  
The 403GCX can interface to either 3V or 5V  
technologies. The range for supply voltages is  
specified for five-percent margins relative to a  
nominal 3.3V power supply, or +/- 100mV at 3.4  
Volt supply with 403GCX-3JC80A and 403GCX-  
3BC80A.  
The 403GCX is designed to operate within the  
case temperature range from -40°C to 120°C.  
Thermal resistance values are shown in Table 7:  
Table 7. Thermal Resistance (°C/Watt)  
Airflow-ft/min (m/  
Device operation beyond the conditions specified  
in Table 9 is not recommended. Extended opera-  
tion beyond the recommended conditions may  
affectdevice reliability:  
sec)  
Parameter  
0
(0)  
100  
(0.51) (1.02)  
200  
2
2
2
θ
θ
JC Junction to case  
Table 9. Operating Conditions  
CA Case to ambient  
Sym  
bol  
Parameter  
Min Max Unit  
PQFP (no heatsink)  
37.2  
30  
31.6  
29.8  
PBGA (no heatsink)5  
VDD Supply voltage:  
403GCX-3JC50/66/80  
Notes:  
3.14 3.47  
3.3 3.5  
3.14 3.47  
V
1. Case temperature Tm is measured at top center of  
C
403GCX-3JC80A  
case surface with device soldered to circuit board.  
403GCX-3BC50/66/80  
403GCX-3BC80A  
2. Tm = Tm – P×θCA, where Tm is ambient tem-  
A
C
A
perature.  
3.3  
3.5  
3. TmCMax = TmJMax – P×θJC, where TmJMax is maxi-  
mum junction temperature and P is power con-  
sumption.  
4. The above assumes that the chip is mounted on a  
card with at least one signal and two power planes.  
1
Clock frequency :  
FC  
403GCX-3JC50/3BC50  
403GCX-3JC66/3BC66  
403GCX-3JC80/3BC80  
403GCX-3JC80A/3BC80A  
24  
24  
24  
24  
25 MHz  
33  
40  
40  
ELECTRICAL SPECIFICATIONS  
Absolute Maximum Ratings  
TmC Case temperature  
403GCX-3JC50/66/80/80A -40  
85  
85  
°C  
403GCX-3BC50/66/80/80A -40  
The absolute maximum ratings in Table 8 below  
are stress ratings only. Operation at or beyond  
these maximum ratings may cause permanent  
damage to the device.  
Note:  
1. These frequencies do not account for T . See  
CS  
Table 12.  
Power Considerations  
Power dissipation is determined by operating fre-  
quency, temperature, and supply voltage, as well  
as external source/sink current requirements.  
Typical power dissipation is 0.34 W at 25/50  
MHz, 0.42 W at 33/66 MHz, or 0.51 W at 40/80  
MHz, TmC = 55 °C, and VCC = 3.3 V, with an  
average 50pF capacitive load. Typical power dis-  
sipation is 0.54w for 403GCX-3JC80A and  
403GCX-3BC80A. TmC = 55 °C, and VCC = 3.3  
V, with an average 50pF capacitive load. Derat-  
ing curves are provided in the section, "Output  
Derating for Capacitance and Voltage," on page  
33.  
Table 8. 403GCX Maximum Ratings  
Parameter  
Maximum Rating  
Supply voltage with  
respect to GND  
-0.5V to +3.8V  
Voltage on other pins with  
respect to GND  
-0.5V to +5.5V  
-40°C to +120°C  
-65°C to +150°C  
Case temperature under  
bias  
Storage temperature  
22  
 
 
 复制成功!