IBM11S2325HP IBM11S4325HP
IBM11S2325HM IBM11S4325HM
2M/4M x 32 SO DIMM Module
Absolute Maximum Ratings
Rating
Symbol
V
CC
V
IN
V
OUT
T
OPR
T
STG
P
D
I
OUT
Parameter
Power Supply Voltage
Input Voltage
Output Voltage
Operating Temperature
Storage Temperature
Power Dissipation
Short Circuit Output Current
3.3 Volt
-0.5 to + 4.6
5.0 Volt
-1.0 to + 7.0
Units
V
V
V
°C
°C
W
mA
Notes
1
1
1
1
1
1, 2
1
-0.5 to min (V
CC
+ 0.5, 4.6) -0.5 to min (V
CC
+ 0.5, 7.0)
-0.5 to min (V
CC
+ 0.5, 4.6) -0.5 to min (V
CC
+ 0.5, 7.0)
0 to +70
-55 to +150C
1.3 (4MB) 2.6 (8MB)
50
0 to +70
-55 to +150C
2.0 (4MB) 4.0 (8MB)
50
1. Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only, and device functional
operation at or above the conditions indicated is not implied. Exposure to absolute maximum rating conditions for extended peri-
ods may affect reliability.
2. Maximum power occurs when all banks are active.
Recommended DC Operating Conditions
Symbol
V
CC
V
IH
V
IL
Parameter
Min
Supply Voltage
Input High Voltage
Input Low Voltage
3.0
2.0
-0.5
(T
A
= 0 to 70
°
C)
5.0 Volt
Max
3.6
V
CC
+ 0.5
0.8
Min
4.5
2.4
-0.5
Typ
5.0
—
—
Max
5.5
V
CC
+ 0.5
0.8
Units
V
V
V
Notes
1
1, 2
1, 2
3.3 Volt
Typ
3.3
—
—
1. All voltages referenced to V
SS
.
2. V
IH
may overshoot to V
CC
+ 1.2V for pulse widths of
≤
4.0ns with 3.3 Volt, or V
CC
+ 2.0V for pulse widths of
≤
4.0ns (or V
CC
+ 1.0V
for
≤
8.0ns) with 5.0 Volt. Additionally, V
IL
may undershoot to -2.0V for pulse widths
≤
4.0ns (or -1.0V for
≤
8.0ns). Pulse widths
measured at 50% points with amplitude measured peak to DC reference.
Capacitance
Symbol
C
I1
C
I2
C
I2
C
I4
C
I5
C
IO
(T
A
= 0 to +70°C, V
CC
= 3.3± 0.3V or 5.0
±
0.25V)
Parameter
2M x 32
Max
38
24
24
14
40
15
4M x 32
Max
58
24
24
21
68
22
Units
pF
pF
pF
pF
pF
pF
Input Capacitance (A0-A9)
Input Capacitance (4MB: RAS0, 8MB: RAS0, 1)
Input Capacitance (4MB: RAS2, 8MB: RAS2, 3)
Input Capacitance (CAS)
Input Capacitance (WE)
Input - Output Capacitance (DQ0-DQ34)
75H1718
SA14-4471-00
Revised 4/96
©IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
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