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IBM0612804GT3B-8N 参数 Datasheet PDF下载

IBM0612804GT3B-8N图片预览
型号: IBM0612804GT3B-8N
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 16MX8, 0.8ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66]
分类和应用: 动态存储器双倍数据速率光电二极管内存集成电路
文件页数/大小: 79 页 / 1362 K
品牌: IBM [ IBM ]
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IBM0612404GT3B  
IBM0612804GT3B  
Advance Rev 0.2  
128Mb Double Data Rate Synchronous DRAM  
Weak Strength Driver Pulldown and Pullup Characteristics  
1. The full variation in driver pulldown current from minimum to maximum process, temperature and voltage  
will lie within the outer bounding lines of the V-I curve.  
2. It is recommended that the “typical” IBIS pulldown V-I curve lie within the shaded region of the V-I curve.  
Weak Strength Driver Pulldown Characteristics  
Maximum  
80  
Typical High  
Typical Low  
Minimum  
0
0
2.7  
V
(V)  
OUT  
3. The full variation in driver pullup current from minimum to maximum process, temperature and voltage  
will lie within the outer bounding lines of the V-I curve.  
4. It is recommended that the “typical” IBIS pullup V-I curve lie within the shaded region of the V-I curve.  
Weak Strength Driver Pullup Characteristics  
0
Minimum  
Typical Low  
Typical High  
Maximum  
-80  
0
2.7  
V
(V)  
OUT  
5. The full variation in the ratio of the maximum to minimum pullup and pulldown current will not exceed 1.7,  
for device drain to source voltages from 0.1 to 1.0.  
6. The full variation in the ratio of the “typical” IBIS pullup to “typical” IBIS pulldown current should be unity  
+ 10%, for device drain to source voltages from 0.1 to 1.0. This specification is a design objective only. It  
is not guaranteed.  
7. These characteristics are intended to obey the SSTL_2 class I standard.  
8. This specification is intended for DDR SDRAM only.  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
06K0566.F39350  
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