HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
C
H
Marking:
Date Code
H 1 1 7
Control Code
Pb Free Mark
Pb-Free: " "
(Note)
Normal: None
Spec. No. : HM200101
Issued Date : 2001.07.30
Revised Date : 2004.12.21
Page No. : 4/5
B
1
E
F
G
A
2
3
D
Note: Green label is used for pb-free packing
J
I
Pin Style: 1.Base 2.Collector 3.Emitter
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
Min.
4.40
4.05
1.50
2.40
0.36
*1.50
*3.00
1.40
0.35
Max.
4.60
4.25
1.70
2.60
0.51
-
-
1.60
0.41
*: Typical, Unit: mm
3-Lead SOT-89 Plastic
Surface Mounted Package
HSMC Package Code: M
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM117
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
