8
Package Dimensions
A
B
5.00 ± 0.20
5.00 ± 0.20
(0.197 ± 0.008)
(0.197 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
d
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
0.70 (0.028)
MAX.
1.50 ± 0.15
(0.059 ± 0.006)
31.60
MIN.
31.60
(1.244)
MIN.
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 ± 0.10
(0.020 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
SQ. TYP.
1.00
(0.039)
1.00
MIN.
MIN.
(0.039)
5.80 ± 0.20
5.80 ± 0.20
(0.228 ± 0.008)
(0.228 ± 0.008)
CATHODE
FLAT
CATHODE
FLAT
2.54 ± 0.38
2.54 ± 0.38
(0.100 ± 0.015)
(0.100 ± 0.015)
NOTES:
PART NO.
d
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
HLMP-XX10
HLMP-XX17
HLMP-XX26
HLMP-XX32
12.37 ± 0.25
(0.487 ± 0.010)
3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
12.42 ± 0.25
(0.489 ± 0.010)
4. RECOMMENDED PC BOARD HOLE DIAMETERS:
12.52 ± 0.25
(0.493 ± 0.010)
•
LAMP PACKAGE A WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/ 1.067 (0.044/ 0.042).
11.96 ± 0.25
(0.471 ± 0.010)
•
LAMP PACKAGE B WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS
= 0.965/ 0.889 (0.038/ 0.035).
5. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.
HP [ HEWLETT-PACKARD ]
