Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Case Temperature
Junction Temperature
Lead Solder Temperature
Average Input Current
Peak Transient Input Current
(<1
µs
pulse width, 300 pps)
Reverse Input Voltage
“High” Peak Output Current
“Low” Peak Output Current
Supply Voltage
Output Voltage
Emitter Power Dissipation
Output Power Dissipation
Total Power Dissipation
Notes:
2. Maximum pulse width = 10
µ
s, maximum duty cycle = 0.2%. This value is intended to allow for component tolerances for designs with I
O
peak minimum =
2.0A. See Applications section for additional details on limiting I
OH
peak.
4. Derate linearly above 102
°
C free air temperature at a rate of 6mW/
°
C for typical case-to-ambient thermal resistance (
θ
CA
=140
°
C/W). Refer to Figure 35
and 36.
1. No derating required for typical case-to-ambient thermal resistance (
θ
CA
=140
°
C/W). Refer to Figure 35.
Symbol
T
S
T
A
T
C
T
J
Min.
-65
-55
Max.
+150
+125
+145
+150
260 for 10s
Units
°
C
°
C
°
C
°
C
°
C
Note
I
F AVG
I
F PK
V
R
I
OH (PEAK)
I
OL (PEAK)
(V
CC
-V
EE
)
V
O (PEAK)
P
E
P
O
P
T
0
0
25
1.0
5
2.5
2.5
35
V
CC
45
250
295
mA
A
V
A
A
V
V
mW
mW
mW
1
2
2
1
3
4
3. Derate linearly above 102
°
C free air temperature at a rate of 6mW/
°
C for typical case-to-ambient thermal resistance (
θ
CA
=140
°
C/W). Refer to Figure 36.
ESD Classification
MIL-STD-883, Method 3015
(
▲
), Class 1
Recommended Operating Conditions
Parameter
Power Supply Voltage
Input Current (ON)
Input Voltage (OFF)
Operating Temperature
Symbol
(V
CC
– V
EE
)
I
F (ON)
V
F (OFF)
T
A
Min.
15
10
-3.0
-55
Max.
30
18
0.8
125
Units
Volts
mA
Volts
°C
4
HP [ AGILENT(HEWLETT-PACKARD) ]
