5
Absolute Maximum Ratings
Storage Temperature ................................................. -65°C to +150°C
Operating Temperature ............................................... -55°C to +125°C
Lead Solder Temperature ................................................ 260°C for 10 s
1.6 mm below seating plane
Forward Input Current – I
I
(each channel) ................................. 60 mA
2
Reverse Input Current ................................................................. 60 mA
Supply Voltage – V
CC
....................................... 7 V (1 Minute Maximum)
Enable Input Voltage – V
E
(each channel) ...................................... 5.5 V
Not to exceed V
CC
by more than 500 mV
Output Collector Current – I
O
(each channel) ............................. 25 mA
Output Collector Power Dissipation (each channel) ................... 40 mW
Output Collector Voltage – V
O
(each channel) ................................... 7 V
Total Package Power Dissipation .............................................. 564 mW
Input Power Dissipation (each channel) ................................... 168 mW
Schematic
A 0.1
µ
F BYPASS CAPACITOR
MUST BE CONNECTED BETWEEN
PINS 10 AND 15 (SEE NOTE 1).
ESD Classification
(MIL-STD-883, Method 3015) .............................................. (∆), Class 1
Recommended Operating Conditions
Parameter
Input Current, Low Level
Input Current, High Level*
Supply Voltage, Output
High Level Enable Voltage
Low Level Enable Voltage
Fan Out (@ R
L
= 4 kΩ)
Operating Temperature
Symbol
I
IL
I
IH
V
CC
V
EH
V
EL
N
T
A
-55
Min.
0
12.5
4.5
2.0
0
Max.
250
60
5.5
V
CC
0.8
5
125
Units
µA
mA
V
V
V
TTL
Loads
°C
*12.5 mA condition permits at least 20% guardband for optical coupling variation. Initial
switching threshold is 10 mA or less.
HP [ AGILENT(HEWLETT-PACKARD) ]
