Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
[1]
Supply Voltages
Input Voltage
Output Voltage
Average Output Current
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
T
S
T
A
V
DD1
, V
DD2
V
I
V
O
I
O
Min.
–55
–40
0
–0.5
–0.5
Max.
125
85
6.0
V
DD1
+0.5
V
DD2
+0.5
10
Units
°C
°C
Volts
Volts
Volts
mA
260°C for 10 sec., 1.6 mm below seating plane
See Solder Reflow Temperature Profile Section
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Logic High Input Voltage
Logic Low Input Voltage
Input Signal Rise and Fall Times
Symbol
T
A
V
DD1
, V
DD2
V
IH
V
IL
t
r,
t
f
Min.
–40
4.5
2.0
0.0
Max.
85
5.5
V
DD1
0.8
1.0
Units
°C
V
V
V
ms
Electrical Specifications
Test conditions that are not specified can be anywhere within the recommended operating range.
All typical specifications are at T
A
= +25°C, V
DD1
= V
DD2
= +5 V.
Parameter
Logic Low Input Supply Current
[2]
Logic High Input Supply Current
[2]
Output Supply Current
Input Current
Logic High Output Voltage
Logic Low Output Voltage
Symbol
I
DD1L
I
DD1H
I
DD2L
I
DD2H
I
I
V
OH
V
OL
–10
4.4
4.0
5.0
4.8
0
0.5
0.1
1.0
Min.
Typ.
7
1.8
12.5
12
Max.
10
3
17.5
16.5
10
Units
mA
mA
mA
mA
µA
V
V
V
V
I
O
= –20
µA,
V
I
= V
IH
I
O
= –4 mA, V
I
= V
IH
I
O
= 20
µA,
V
I
= V
IL
I
O
= 4 mA, V
I
= V
IL
Test Conditions
V
I
= 0 V
V
I
= V
DD1
7
HP [ AGILENT(HEWLETT-PACKARD) ]
