Benefits: Lens minimizes cross-talk and
often eliminates the need for apertures
in non-critical applications. Low profile
components may be mounted on the
printed circuit board, lens up or inverted,
allowing flexibility in layouts for multiple
channel and custom arrays. High intensity
infrared emitter can be used with either the
SMD2440 phototransistor or the SMD2420
photodiode. Small size and high power
dissipation properties of the infrared
emitter promote PC board miniaturization
and high density placement. Potential
applications include optical encoders
for motion control, computer peripherals,
vending and point-of-sale applications,
smoke detectors, and medical equipment.
EMITTERS (PLASTIC AND CERAMIC SEP8706.
PACKAGE)
Features: Side-looking plastic package
SEP8505.
• 50° (nominal) beam angle • 880 nm
wavelength • Mechanically and spectrally
matched to SDP8406 phototransistor,
SDP8106 photodarlington, and
Features: T-1 package • 15° (nominal)
beam angle • 935 nm wavelength
• Consistent on-axis optical properties
• Mechanically and spectrally matched to
SDP8405 phototransistor and SDP8105
photodarlington
SDP8000/8600 series Schmitt trigger
Benefits: Infrared emitter molded in
a side-emitting, smoke-gray plastic
package. Chip positioned to emit radiation
through a plastic lens from the side of the
package. Exhibits 70 % greater power
intensity than GaAs devices at the same
forward current.
Benefits: Infrared emitter transfer molded
in a T-1 red plastic package. Transfer
molding of this device provides enhanced
optical centerline performance compared
to other molding processes. Lead lengths
are staggered to provide a simple method
of polarity identification.
SEP8736.
SEP8506.
Features: Side-emitting, tight-beam
sidelooker in a plastic package
• 10° (nominal) beam angle • 880 nm
wavelength • Enhanced coupling distance
• Mechanically and spectrally matched to
SDP8436 phototransistor
Features: Side-emitting plastic package
• 50° (nominal) beam angle • 935 nm
wavelength • Mechanically and spectrally
matched to SDP8406 phototransistor,
SDP8106 photodarlington, and
PHOTOTRANSISTORS - METAL
PACKAGE
SD1440(L).
Features: Compact, metal-can coaxial
package • 24° (nominal) acceptance
angle • Wide sensitivity ranges • Wide
operating temperature range -55 °C to 125
°C [-67 °F to 257 °F] • Mechanically and
spectrally matched to SE1450 and SE1470
infrared emitters
SDP8000/8600 series Schmitt trigger
Benefits: Infrared emitter molded in a
side-emitting smoke-gray plastic package.
Body and integral lens design combines
the mounting advantage of a side-emitting
package with the narrow emission
Benefits: Infrared emitter molded in a
side-emitting red plastic package. Chip
positioned to emit radiation through a
plastic lens from the side of the package.
pattern of a T-1 style device. Designed
for potential applications which require
longer coupling distances than standard
side-emitting devices can provide, such
as touch screens. Infrared emitters are
often well suited to potential applications
in which adjacent channel crosstalk could
be a problem.
Benefits: Phototransistor mounted in a
glass-lensed, metal-can coaxial package.
May have a tab or second lead welded
to the can as an optional feature. Both
leads are flexible and may be formed to fit
various mounting configurations.
SEP8705.
Features: T-1 package • 15° (nominal)
beam angle • 880 nm wavelength
• Consistent optical properties
• Mechanically and spectrally matched to
SDP8405 phototransistor and SDP8105
photodarlington
SD2440.
Benefits: Infrared emitter transfer molded
in a T-1 smoke gray plastic package.
Transfer molding of this device assures
superior optical centerline performance
compared to other molding processes.
Exhibit 70% greater power intensity
compared to GaAs devices at the
same forward current. Lead lengths are
staggered to provide a simple method of
polarity identification.
Features: Miniature, hermetically sealed,
pill-style, metal-can package • 48°
(nominal) acceptance angle • Wide
operating temperature range -55 °C to
125 °C [-67 °F to 257 °F] • Often ideal for
direct mounting to double sided printed
circuit boards • Wide sensitivity ranges
• Mechanically and spectrally matched to
SE2460 and SE2470 infrared emitters
SME2470.
Features: Small ceramic package
• Glass-lensed optics for efficient optical
coupling • Upright or inverted mounting
capability • Low profile, small size for
flexible layout of multiple channels
and custom arrays • Compatible with
automated solder processes • Choice of
photodiode or phototransistor detectors
• Infrared emitter features high power
dissipation capability • Tape and reel
packaging option (pick and place
machine compatible)
Benefits: Phototransistor mounted in a
hermetically sealed glass- lensed metal-
can package.
Unless otherwise noted, potential applications include printers and copiers, motion control systems, metering systems, liquid-level
sensing, data storage systems, scanning, automated transaction, drop sensors, and other noninvasive medical equipment.
www.honeywell.com/sensing
15
HONEYWELL [ Honeywell ]
