HI-8585, HI-8586
PACKAGE THERMAL CHARACTERISTICS
MAXIMUM ARINC LOAD 9, 10
SUPPLY CURRENT (mA) 2
Ta = 25oC Ta = 85oC Ta=125oC
ARINC 429
JUNCTION TEMP, Tj (°C)
Ta = 25oC Ta = 85oC Ta=125oC
PACKAGE STYLE 1
DATA RATE
Low Speed 3
High Speed 4
Low Speed
High Speed
Low Speed
High Speed
16.8
27.3
17.4
27.6
17.1
27.3
17.2
26.7
17.5
27.1
17.2
27.1
16.9
25.9
16.9
25.9
16.7
26.2
58
75
68
97
52
57
116
132
126
147
110
112
157
169
166
186
151
157
8 Lead Plastic DIP
8 Lead Plastic ESOIC 5
8 Lead Plastic ESOIC 6
TXAOUT and TXBOUT Shorted to Ground 7, 8, 9, 10
SUPPLY CURRENT (mA) 2
Ta = 25oC Ta = 85oC Ta=125oC
ARINC 429
JUNCTION TEMP, Tj (°C)
Ta = 25oC Ta = 85oC Ta=125oC
PACKAGE STYLE 1
8 Lead Plastic DIP
DATA RATE
Low Speed 3
High Speed 4
Low Speed
High Speed
Low Speed
High Speed
53.6
46.9
46.4
42.1
48.5
46.8
50.7
38.7
47.6
43.8
45.6
41.1
52.2
42.5
68.1
67.1
46.1
40.5
131
135
167
177
112
116
181
181
191
212
161
168
217
219
221
223
186
197
8 Lead Plastic ESOIC 5
8 Lead Plastic ESOIC 6
Notes:
1. All data taken in still air on devices soldered to single layer copper PCB (3" X 4.5" X .062").
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
as this is considered unrealistic for high speed operation.
5. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered to the PCB.
6. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink soldered to the PCB.
7. Similar results would be obtained with TXAOUT shorted to TXBOUT.
8. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
9. Data will vary depending on air flow and the method of heat sinking employed.
10. Current values are per supply.
HEAT SINK - ESOIC PACKAGES
An 8-pin thermally enhanced SOIC package is used for the
HI-8585/HI-8586 products. The ESOIC package includes
a metal heat sink located on the bottom surface of the
device. This heat sink should be soldered down to the
printed circuit board for optimum thermal dissipation. The
heat sink is electrically isolated from the chip and can be
soldered to any ground or power plane. However, since
the chip’s substrate is at V+, connecting the heat sink to
this power plane is recommended to avoid coupling noise
into the circuit.
HOLT INTEGRATED CIRCUITS
5
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
