HI-3582, HI-3583
ABSOLUTE MAXIMUM RATINGS
Power Dissipation at 25°C
Plastic Quad Flat Pack ..................1.5 W, derate 10mW/°C
Ceramic J-LEAD CERQUAD ...... 1.0 W, derate 7mW/°C
Supply Voltages VDD ......................................... -0.3V to +4.0V
V+ ......................................................... +11.0V
V- ......................................................... -11.0V
DC Current Drain per pin .............................................. 10mA
Storage Temperature Range ........................ -65°C to +150°C
Voltage at pins RIN1A, RIN1B, RIN2A, RIN2B .. -120V to +120V
Voltage at any other pin ............................... -0.3V to VDD +0.3V
Solder temperature (Reflow) ............................................. 260°C
Operating Temperature Range (Industrial): .... -40°C to +85°C
(Extended): .....-55°C to +125°C
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only.
Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
HEAT SINK - CHIP-SCALE PACKAGE ONLY
The HI-3582PCI/T/M and HI-3583PCI/T/M use a 44-pin
plastic chip-scale package. This package has a metal heat
sink pad on its bottom surface. This heat sink is electrically
connected to the die. To enhance thermal dissipation, the
heat sink can be soldered to matching circuit board pad.
The heat sink may be connected to V+ or left floating.
Do not connect heat sink pad to VDD, GND or V-.
HOLT INTEGRATED CIRCUITS
12
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
