HI-3189 PACKAGE DIMENSIONS
16-PIN CERDIP
.790 max
(20.006 max)
.050 max
(1.27 max)
inches (millimeters)
Package Type: 16D
.005 min
(.127 min)
.288
±.005
(7.315
±.125)
.056 typ
(1.422 typ)
.100
BSC
(2.54)
.310
±.010
(7.874
±.254)
.180 max
(4.572 max)
.200 max
(5.080 max)
.015 min
(.381 min)
.125 min
(3.175 min)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.018
±.003
(.457
±.760)
0° to 15°
.010
±.002
(.254
±.051)
16-PIN CERAMIC SIDE-BRAZED DIP
inches (millimeters)
Package Type: 16C
.810
max
(20.574)
.295
±.010
(7.493
±.254)
.050
±.005
(1.270
±.127)
.035 ± .010
(.889
±.254)
BASE
PLANE
SEATING
PLANE
.100
BSC
(2.54)
.300 ± .010
(7.620
±.254)
PIN 1
.200
max
(5.080)
.125 min
(3.175)
.010
±.002
(.254
±.051)
.018 ± .002
(.457
±.051)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
8
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
