HI-3189
ADDITIONAL PIN CONFIGURATIONS
(See page 1 for 16-Pin Ceramic Side-Brazed DIP))
SYNC
RATE SELECT
N/C
VREF
VLOGIC
N/C
AMPB
VREF
25
24
23
1
2
3
16
VLOGIC
15
AMPB
14
CLOCK
4
3
2
1 28 27 26
N/C
DATA (A)
N/C
N/C
CAPA
N/C
N/C
5
6
7
8
9
10
11
HI-3189CL
22
21
20
19
12 13 14 15 16 17 18
CLOCK
N/C
DATA (B)
CAPB
N/C
AMPA
N/C
RATE SELECT
SYNC
DATA(A)
4
HI-3189
13
DATA(B)
CR
12
CAPB
CAPA
5
6
7
8
11
OUTB
10
AMPA
9
+VS
-VS
GND
OUTA
28 - Pin Ceramic LCC
(See page 1 for additional pin configurations)
N/C
OUTA
-VS
GND
+VS
OUTB
N/C
16 - Pin Cerdip package
(See page 1 for additional pin configurations)
ORDERING INFORMATION
HI - 3189 xx x
PART
NUMBER
I
T
M
TEMPERATURE
RANGE
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
BURN
IN
No
No
Yes
LEAD
FINISH
Theta
JA
Theta
JC
FLOW
I
T
M
PART PACKAGE
NUMBER DESCRIPTION
CD
CL
CR
16 PIN CERAMIC SIDE BRAZED DIP (16C)
16 PIN CERDIP (16D) not available with ‘M’ flow
Gold (’M’ Flow: Solder) 70°C/W 28°C/W
Solder
70°C/W 28°C/W
28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) (28S) Gold (’M’ Flow: Solder) 60°C/W 25°C/W
HOLT INTEGRATED CIRCUITS
6
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
