HI-1579, HI-1581
TRANSMITTER
TXA/B
TXA/B
TXINHA/B
52.5
W
(.75 Zo)
35
W
(.5 Zo)
52.5
W
(.75 Zo)
BUSA/B
1:2.5
Point
“A
T
”
1:1.4
52.5
W
(.75 Zo)
35
W
(.5 Zo)
BUSA/B
Isolation
Transformer
Point
“A
T
”
2.5:1
Coupling
Transformer
52.5
W
(.75 Zo)
1.4:1
RECEIVER
RXA/B
RXA/B
Coupling
Transformer
Isolation
Transformer
RXENA/B
Figure 3. Transformer Coupled Test Circuits
HEAT SINK - ESOIC & CHIP-SCALE
PACKAGE
The HI-1579PSI/T/M and HI-1581PSI/T/M use a 20-pin
thermally enhanced SOIC package. The HI-1579PCI/T/M
and HI-1581PCI/T/M use a plastic chip-scale package
(QFN). These packages include a metal heat sink located
on the bottom surface of the device. This heat sink
should be soldered down to the printed circuit board for
optimum thermal dissipation. The heat sink is electrically
isolated and may be soldered to any convenient power or
ground plane.
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt's family of MIL-STD-1553
transceivers. Layout considerations, as well as
recommended interface and protection components are
included.
THERMAL CHARACTERISTICS
PART NUMBER
HI-1579PSI / T / M
HI-1581PSI / T / M
HI-1579CDI / T / M
HI-1581CDI / T / M
HI-1579PCI / T / M
HI-1581PCI / T / M
PACKAGE STYLE
CONDITION
Heat sink
unsoldered
Heat sink
soldered
Socketed
Heat sink
unsoldered
Ø
JA
54°C/W
47°C/W
62°C/W
49°C/W
JUNCTION TEMPERATURE
T
A
=25°C
52°C
49°C
56°C
50°C
T
A
=85°C T
A
=125°C
112°C
109°C
116°C
110°C
152°C
149°C
156°C
150°C
20-pin Thermally
enhanced plastic
SOIC (ESOIC)
20-pin Ceramic
side-brazed DIP
44-pin Plastic chip-
scale package (QFN)
Data taken at VDD=3.3V, continuous transmission at 1Mbit/s, single transmitter enabled.
HOLT INTEGRATED CIRCUITS
6
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
