PACKAGE DIMENSIONS
44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
inches (millimeters)
Package Type: 44PCS
.276
BSC
.203 .006
(5.15 .15)
(7.00)
.020
BSC
(0.50)
.276
(7.00)
.203 .006
(5.15 .15)
Top View
Bottom
View
.010
BSC
typ
(0.25)
.016 .002
(0.40 .05)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.039
(1.00)
.008
(0.2)
max
typ
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
10