PACKAGE DIMENSIONS
44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
7.00
BSC
(0.276)
millimeters (inches)
Package Type: 44PCS
5.50 ± 0.050
(0.217 ± 0.002)
0.50 BSC
(0.0197)
7.00
BSC
(0.276)
Top View
5.50 ± 0.050
(0.217 ± 0.002)
Bottom
View
0.25 ± 0.050
(0.010 ± 0.002)
1.00
max
(0.039)
0.200 typ
(0.008)
Electrically isolated heat
sink pad on bottom of
package
Connect to any ground or
power plane for optimum
thermal dissipation
0.400 ± 0.050
(0.016 ± 0.002)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
11