PACKAGE DIMENSIONS
20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
.008 ± .005
(.215 ± .115)
.504
BSC
(12.80)
inches (millimeters)
Package Type: 20HWE
.295 ± .015
(7.495 ± .385)
.407
BSC
(10.33)
Top View
.295
BSC
(7.50)
.210 ± .015
(5.335 ± .385)
Bottom
View
See Detail A
.016 ± .004
(.419 ± .109)
.086 ± .005
(2.181 ± .131)
Electrically isolated heat
sink pad on bottom of
package
Connect to any ground or
power plane for optimum
thermal dissipation
.050
BSC
(1.27)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
0° to 8°
.033 ± .017
(.835 ± .435)
.008 ± .004
(.200 ± .100)
Detail A
20-PIN CERAMIC SIDE-BRAZED DIP
1.000
±.010
(25.400
±.254)
.310
±.010
(7.874
±.254)
.050 TYP.
(1.270 TYP.)
.200
max
(5.080)
.085
±.009
(2.159
±
.229)
inches (millimeters)
Package Type: 20C
.300
± .010
(7.620
±
.254)
.125 min
(3.175)
.017
±.002
(.432
±.051)
.100
BSC
(2.54)
.010
+
002/-.001
.
(.254
±.051/-
.025)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
9
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
